WebSemi Yield Management System provides a flexible all-in-one yield management and testing data analysis solution for fabless semiconductor manufacturers, IDMs (Integrated Device Manufacturers), as well as outsourced assembly and test companies.
Capable to manage all stages testing data of semiconductor manufacturing, from WAT/PCM, CP to FT tests, with strong traceability and cross stages data analysis ability, users could freely perform commonality analysis, correlation analysis and and regression analysis so on.
Instant data analysis capabilities, allowing statistical analysis of your data at any time, performing statistical summary, data visualization and analysis of variance of semiconductor testing data.
Enterprise-oriented and flexible system architecture, can be deployed easily based on business size.
Flexible software architecture that can be deployed according to the scale of business. Deployment scenarios can provide from simple stand-alone solutions to high performance cluster solutions.
Systems can be seamlessly integrated into the customer's data system and its supply chain systems, capable to automatically find and import new data.
Natively supporting STDF format data files, we provide data file format conversion services, fully support a variety of non-standard data file importing.
Open data access APIs to users, which allows users to develop data processing and auto reporting applications.
Perfect wafer and dut maps for software bins, hardware bins and parametric values, as well as the according composite wafer and dut maps, etc.
Easy for yield summary and analysis, identifying the major failures, variety of data analysis plots, including trend charts, bar chart, pareto chart, histograms, scatter chart, boxplot and probability plot etc., capable for regression analysis and variance analysis.
Based on statistical analysis methodology, WebSemi provides SYL/SBL method, to perform real-time monitor of testing yield and software & hardware binning. Abnormal testing results will be sent timely to users through mail system.